System On Chip (SoC)

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
XCVP1502-2LSEVSVA3340

XCVP1502-2LSEVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

0
RFQ
XCVP1502-2LSEVSVA3340Datasheet Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Premium FPGA, 3.7M Logic Cells 0°C ~ 100°C (TJ) - - 3340-FCBGA (55x55)
AGFA027R24C2I1V

AGFA027R24C2I1V

IC FPGA AGILEX-F 2340FBGA

Intel

0
RFQ
AGFA027R24C2I1VDatasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA027R24C2I1VB

AGFA027R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0
RFQ
AGFA027R24C2I1VBDatasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB027R24C2I1V

AGFB027R24C2I1V

IC FPGA AGILEX-F 2340FBGA

Intel

0
RFQ
AGFB027R24C2I1VDatasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGIB027R31B1E2V

AGIB027R31B1E2V

IC FPGA AGILEX-I 3184FBGA

Intel

0
RFQ
AGIB027R31B1E2VDatasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGIB027R31B2E1V

AGIB027R31B2E1V

IC FPGA AGILEX-I 3184FBGA

Intel

0
RFQ
AGIB027R31B2E1VDatasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGIB027R31B1E2VB

AGIB027R31B1E2VB

IC FPGA AGILEX-I 3184BGA

Intel

0
RFQ
AGIB027R31B1E2VBDatasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31B2E1VB

AGIB027R31B2E1VB

IC FPGA AGILEX-I 3184BGA

Intel

0
RFQ
AGIB027R31B2E1VBDatasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB027R24C2I1VB

AGFB027R24C2I1VB

AGFB027R24C2I1VB

Intel

0
RFQ
AGFB027R24C2I1VBDatasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGIB027R29A2I3V

AGIB027R29A2I3V

IC FPGA AGILEX-I 2957BGA

Intel

0
RFQ
AGIB027R29A2I3VDatasheet Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGIB022R29A2I2VB

AGIB022R29A2I2VB

IC FPGA AGILEX-I 2957BGA

Intel

0
RFQ
AGIB022R29A2I2VBDatasheet Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGIB022R29A2I2V

AGIB022R29A2I2V

AGIB022R29A2I2V

Intel

0
RFQ
AGIB022R29A2I2VDatasheet Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGIB027R29B1E2V

AGIB027R29B1E2V

AGIB027R29B1E2V

Intel

0
RFQ
AGIB027R29B1E2VDatasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
XCZU48DR-L2FSVE1156I

XCZU48DR-L2FSVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0
RFQ
XCZU48DR-L2FSVE1156IDatasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU48DR-L2FFVE1156I

XCZU48DR-L2FFVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0
RFQ
XCZU48DR-L2FFVE1156IDatasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
AGIB023R18A1I1V

AGIB023R18A1I1V

IC FPGA AGILEX-I 1805FBGA

Intel

0
RFQ
AGIB023R18A1I1VDatasheet Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGIB023R18A1I1VB

AGIB023R18A1I1VB

IC FPGA AGILEX-I 1805BGA

Intel

0
RFQ
AGIB023R18A1I1VBDatasheet Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGFA027R31C2E4X

AGFA027R31C2E4X

IC FPGA AGILEX-F 3184FBGA

Intel

0
RFQ
AGFA027R31C2E4XDatasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGIB022R31A1I2V

AGIB022R31A1I2V

AGIB022R31A1I2V

Intel

0
RFQ
AGIB022R31A1I2VDatasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB022R31A2I1V

AGIB022R31A2I1V

AGIB022R31A2I1V

Intel

0
RFQ
AGIB022R31A2I1VDatasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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Category Overview

System On Chip (SoC) Products & Selection Guide

System On Chip (SoC) are widely used in industrial automation, automotive electronics, communication equipment, consumer electronics, new energy systems, and many other electronic applications. We offer products from multiple manufacturers, packages, and specifications to help engineers and buyers compare and source suitable components.

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Start with the required electrical specifications, package, operating temperature, application conditions, and manufacturer preference, then compare availability and lead time.

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Send us the part number and required quantity. We can help source hard-to-find parts and suggest suitable alternatives based on key specifications.

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