System On Chip (SoC)
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPFS160TLS-FCSG536IIC SOC RISC-V 536LFBGA |
2 |
|
|
PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
|
XCZU3EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
4 |
|
|
Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S150TS-1FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
24 |
|
|
SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
XC7Z030-3FFG676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
2 |
|
|
Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
A5ED065BB23AE5SR0IC MPU FPGA AGILEX5E ES 839BGA |
9 |
|
|
Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 839-VPBGA (23x23) |
|
A5ED065BB32AE4SR0IC MPU FPGA AGILEX5E ES 1591BGA |
10 |
|
|
Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1591-VPBGA (32x32) |
|
XC7Z045-1FFG900IIC SOC CORTEX-A9 667MHZ 900FCBGA |
5 |
|
|
Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU17EG-2FFVC1760EIC SOC CORTEX-A53 1760FCBGA |
8 |
|
|
Zynq® UltraScale+™ MPSoC EG | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
UPD72874AGC-YEB-ASOC / AV LINK |
29 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
KS8695CENTAUR MULTI-PORT GATEWAY |
44 |
|
|
- | 208-BFQFP | Bulk | Active | MPU | ARM922T | - | - | DMA, WDT | Ethernet | 166MHz | - | - | - | - | 208-PQFP (28x28) |
|
UPD72893BGD-LML-ASOC / AV LINK |
80 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
PLCHIP-P10-51220X1P10 PLC ON A CHIP SINGLE, LQFP- |
2 |
|
|
- | 144-LQFP | Box | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PLCHIP-P10-51220X5P10 PLC ON A CHIP 5 PACK, LQFP- |
2 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PLCHIP-P13-51220X5P13 PLC ON A CHIP 5 PACK, LQFP-2 |
2 |
|
|
- | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
|
XAZU2EG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
5 |
|
|
Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
PLCHIP-P10-51220X10P10 PLC ON A CHIP 10 PACK, LQFP |
2 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
XCZU5EG-L2SFVC784EIC SOC CORTEX-A53 784FCBGA |
2 |
|
|
Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
10E00025005X0SMARC 2.1 Module |
3 |
|
|
- | Module | Bulk | Active | MPU | Intel® Atom® X5-E3940 | 32GB | 4GB | HDMI, LVDS, SATA | Ethernet, I2C, MMC/SD/SDIO, PCIe, SPI, UART, USB | - | - | -5°C ~ 60°C | - | - | - |
|
XC7Z014S-1CLG400CIC SOC CORTEX-A9 667MHZ 400BGA |
0 |
|
|
Zynq®-7000 | 400-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 400-CSPBGA (17x17) |
|
XC7Z030-1SBG485CIC SOC CORTEX-A9 667MHZ 485FCBGA |
0 |
|
|
Zynq®-7000 | 484-FBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 484-FCBGA (19x19) |
Category Overview
System On Chip (SoC) Products & Selection Guide
System On Chip (SoC) are widely used in industrial automation, automotive electronics, communication equipment, consumer electronics, new energy systems, and many other electronic applications. We offer products from multiple manufacturers, packages, and specifications to help engineers and buyers compare and source suitable components.
Use the manufacturer, key specification, availability, and Datasheet filters to narrow down the right System On Chip (SoC). If the exact part is not listed, submit an inquiry and our team can help check stock, lead time, and suitable alternatives.
FAQ
How do I choose the right System On Chip (SoC)?
Start with the required electrical specifications, package, operating temperature, application conditions, and manufacturer preference, then compare availability and lead time.
Can I order based on the stock shown on this page?
Inventory can change with supply conditions. For project or volume requirements, please submit an inquiry so current stock, pricing, and lead time can be confirmed.
What if the exact part number I need is not listed?
Send us the part number and required quantity. We can help source hard-to-find parts and suggest suitable alternatives based on key specifications.
Do you provide Datasheets and technical documents?
Yes. Use the Datasheet links in the product list to view available technical documents. If a document is unavailable, contact us and we can help check it.
