System On Chip (SoC)
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCHIP-P10-51220P10 PLC ON A CHIP, LQFP-144, UP |
120 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PSB21653EV1.4-GINCA -IP2 SINGLE-CHIP IP PHONE W |
429 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
R8J66744BG#R0SOC/SIP |
909 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SC1201UFH-266SC1201 - 32-BIT MICROPROCESSOR |
18,109 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
PLCHIP-P13-51220P13 PLC ON A CHIP LQFP-208, UP T |
36 |
|
|
- | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
R8J66607B00FP#RF1SSOC/SIP |
2,826 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SC1201UFH-266BSC1201 - 32-BIT MICROPROCESSOR |
37 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
SC1200UFH-266SC1200 - 32-BIT MICROPROCESSOR |
348 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
SC2200UCL-300MICRO PERIPHERAL IC PBGA432 |
7,946 |
|
|
Geode™ | 432-BGA Exposed Pad | Bulk | Active | MPU | x86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 300MHz | - | 0°C ~ 85°C (TC) | - | - | 432-EBGA (40x40) |
|
TDA4AL88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
210 |
|
|
- | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
DRA829JMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
250 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | - | - | 827-FCBGA (24x24) |
|
TDA4VE88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
175 |
|
|
- | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 2MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
TDA4VM88TGBALFRNEXT GENERATION SOC FAMILY FOR L |
494 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
PXB4340EV1.1-GAOP ATM OAM PROCESSOR |
360 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
TDA4VM88TGBALFRQ1NEXT GENERATION SOC FAMILY FOR L |
218 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
M2S050T-FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
60 |
|
|
SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
|
WDC6202GJL250XWIRELESS 27MM 6202 WITH XBUS |
80 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
PXB4330EV2.1AOP ATM OAM PROCESSOR |
246 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
5CSEBA5U19I7NIC SOC CORTEX-A9 800MHZ 484UBGA |
79 |
|
|
Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
5CSEBA6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
60 |
|
|
Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
Category Overview
System On Chip (SoC) Products & Selection Guide
System On Chip (SoC) are widely used in industrial automation, automotive electronics, communication equipment, consumer electronics, new energy systems, and many other electronic applications. We offer products from multiple manufacturers, packages, and specifications to help engineers and buyers compare and source suitable components.
Use the manufacturer, key specification, availability, and Datasheet filters to narrow down the right System On Chip (SoC). If the exact part is not listed, submit an inquiry and our team can help check stock, lead time, and suitable alternatives.
FAQ
How do I choose the right System On Chip (SoC)?
Start with the required electrical specifications, package, operating temperature, application conditions, and manufacturer preference, then compare availability and lead time.
Can I order based on the stock shown on this page?
Inventory can change with supply conditions. For project or volume requirements, please submit an inquiry so current stock, pricing, and lead time can be confirmed.
What if the exact part number I need is not listed?
Send us the part number and required quantity. We can help source hard-to-find parts and suggest suitable alternatives based on key specifications.
Do you provide Datasheets and technical documents?
Yes. Use the Datasheet links in the product list to view available technical documents. If a document is unavailable, contact us and we can help check it.
